Multichip module design,fabrication and testing

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Material type: Text

TextSeries: Electronic packaging and interconection seriesPublication details: New york McGrahill c1995Description: xv,382p : ill ; 24cm. -ISBN:

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Holdings
Item type	Current library	Collection	Call number	Copy number	Status	Date due	Barcode	Item holds
Books	North Eastern Hill University	PHSC	621.381046 LIC (Browse shelf(Opens below))	omp	Available		220420

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Previous	530.41 OMA Elementary solid state physics : principles and applications	530.41 OMA Elementary solid state physics : principles and applications	530.41 OMA Elementary solid state physics : principles and applications	621.381046 LIC Multichip module design,fabrication and testing	001.5 DCE DCE - the OSF distributed computing environment : client/server model and beyond;proceedings.	551.630151 GOR Mathematical problems and methods in hydrodynamic weather forecasting	541.3453 THO Rough surface	Next

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